The most important geometrical characteristic is the flatness of the entire wafer surface.
Wafers are also tested for inclusions and surface damage. The measuring speed requirements for process monitoring are sometimes very high.
-
Applications
- 3D free-form workpieces
- Extruded workpieces
- Moulds
- Semiconductor workpieces
- Lithographic structures
- Metal-plastic composite workpieces
- Prismatic workpieces
- Punched and bent parts
- Packaging
- Shaft-hub connections
- Shafts and axes
- Workpieces with micro-features
- Workpieces with optical functional surfaces
- Tools with geometrically determined cutting edges
- Tools with geometrically indeterminate cutting edges
- Gear wheels
- Cylindrical workpieces
- Industries
- Products
-
Service
- Programming services
- Measuring machine capability analysis, measurement process capability and traceability
- Measurement services with multi-sensor systems or computed tomography
- Repair
- Maintenance
- Calibration
- Installation, relocation and commissioning
- Retrofitting and updates
- Training courses
- Downloads
- About Werth
- Careers
- Foundation
- Publications
- Downloads
